How AiP/AoP Technology Helps Enable 5G And More

For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These challenges include signal loss, signal integrity, and power supply limitation. Antenna in Package (AiP) and Antenna on Package (AoP) constructions provide the required form, fit and function for high-frequency applications in part due to their capacity to house a single antenna or an antenna array. Today’s AiP/AoP constructions make use of existing assembly infrastructure to create complete radio frequency (RF) front-end (RFFE) subsystems inside a single customized System in Package (SiP) module. as.aop tote bag